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Copper Granules, 35 Mesh (Coarse Copper Powder)
Coarse copper powder made of solid metallic high-purity copper metal. Particles are nearly equal in size, appearing as metallic spherical crystals. Recommended for wood inlay, art, and industrial applications requiring solid round multi-side balls. Granular copper is also used in laboratories for sulfur removal from environmental samples. Coarse 35 mesh size, with granules approximately 0.5 mm in diameter.
Product Specifications
Mesh Size | 35 mesh |
Granule Diameter | Approximately 0.5 mm |
CAS No. | 7440-50-8 |
Applications and Benefits:
- Wood inlay projects
- Artistic applications
- Industrial uses requiring solid multi-side balls
- Sulfur removal from environmental samples in laboratories
Caution:
Handle with appropriate safety measures. Refer to the SDS for detailed safety guidelines.
Copper Granules, Mesh 20 (Coarse Copper Powder)
Coarse copper powder made of solid metallic high-purity copper metal. Particles are nearly equal in size, appearing as metallic spherical crystals. Recommended for wood inlay, art, and industrial applications requiring solid round multi-side balls. Granular copper is also used in laboratories for sulfur removal from environmental samples.
Product Specifications
Copper | 99.84% |
Apparent Density | 5.29 g/cc |
Sieve Analysis (Typical) | +20 mesh: 0% -20/+30 mesh: 100% -30/+40 mesh: 0.0% -40 mesh: 0.0% |
CAS No. | 7440-50-8 |
Applications and Benefits:
- Wood inlay projects
- Artistic applications
- Industrial uses requiring solid multi-side balls
- Sulfur removal from environmental samples in laboratories
Caution:
Handle with appropriate safety measures. Refer to the SDS for detailed safety guidelines.
Copper Powder 99+%, Mesh 200
High-purity copper powder made via water atomization and hydrogen reduction. Features very fine, irregular particles and clusters with relatively lower density. Recommended for applications requiring high purity and conductivity, including diamond wheels, sintering, and chemical reactions. Note: Pure copper powders may not exhibit conductivity under low-voltage tests but will conduct when compacted or mixed with oils or resins.
Product Specifications
Purity | 99.3% |
Hydrogen Loss | 0.39% |
Apparent Density | 2.6 - 2.8 g/cc |
Mesh Size | 200 mesh |
Sieve Analysis |
+100 Mesh: Trace +140 Mesh: 1% Max +200 Mesh: 3% Max +325 Mesh: Balance -325 Mesh: 90% Min |
HTS Code | 7406.10.0000 |
NMFC | 30743 |
CAS No. | 7440-50-8 |
Applications and Benefits:
- Thick and thin film pastes
- Conductive inks, paints, and pastes
- Injection molding
- Thermal management
- EDM electrodes
- Antifouling paints
- Thermal sprays
- Sintered alloys/products
- Brazing/soldering paste
- Diamond wheels
- Chemical reactions
Caution:
Handle with care. Refer to the SDS for detailed safety guidelines.
Copper Powder 99.3%, General Purpose, 150 Mesh
The most popular and widely used copper powder, produced by the water atomization method followed by hydrogen reduction. This general-purpose copper powder has diverse applications, including the production of copper compounds, use as a catalyst in chemical formulations, abrasive wheels, carbon brushes, and more. It is important to note that pure copper powders may not exhibit continuity or conductivity under low-voltage multimeter tests due to air gaps and weak particle contacts but will show conductivity under higher voltage, when compacted, or mixed with oils/resins to form a paste.
Product Specifications
Purity | 99.3% |
Apparent Density | 2.7 g/cc |
Nominal Mesh | -140 |
-325 Mesh Ratio | > 50% |
HTS Code | 7406.10.0000 |
NMFC | 30743 |
CAS No. | 7440-50-8 |
Applications and Benefits:
- Production of copper compounds
- Catalyst in chemical formulations
- Abrasive wheels
- Carbon brushes
- Electronics and electrical applications
- Decorative and protective coatings
- Brazing and general-purpose industrial use
Caution:
Handle with care. Refer to the SDS for detailed safety guidelines.
Copper Powder 99.3%, Mesh 325
Ultra-fine, high-purity copper powder made via water atomization and hydrogen reduction. Features spheroidal particles and clusters, offering higher conductivity and lower density. Suitable for metal injection molding and applications requiring high conductivity and purity. Typical applications include conductive inks, paints, pastes, thermal sprays, and sintered products. Note: Pure copper powders may not exhibit conductivity under low-voltage tests but will show conductivity when compacted or mixed with oils or resins.
Product Specifications
Purity | 99.31% |
Hydrogen Loss | 0.39% |
Apparent Density | 2.97 g/cc |
Mesh Size | 325 mesh |
Sieve Analysis |
+60 Mesh: 0% -60/+80 Mesh: 0% -80/+100 Mesh: 0% -100/+140 Mesh: Trace -140/+200 Mesh: Trace -200/+325 Mesh: 0.6% -325 Mesh: 99.4% |
HTS Code | 7406.10.0000 |
NMFC | 30743 |
CAS No. | 7440-50-8 |
Applications and Benefits:
- Thick and thin film pastes
- Conductive inks, paints, and pastes
- Injection molding
- Thermal management
- EDM electrodes
- Antifouling paints
- Thermal sprays
- Sintered alloys/products
- Brazing/soldering paste
Caution:
Handle with care. Refer to the SDS for detailed safety guidelines.
Copper Powder 99.5% - 99.9%
Ultra-fine, very high purity copper powder made via air atomization and hydrogen reduction. Features spherical particles with high conductivity and density. Recommended for diverse applications, including thick and thin film pastes, capacitor chips, end cap terminators, and thermal sprays. Note: Pure copper powders may not exhibit conductivity under low-voltage tests but will show conductivity when compacted or mixed with oils or resins.
Product Specifications
Purity | 99.81% |
Iron | 0.01% |
Hydrogen Loss | 0.18% |
Apparent Density | 4.89 g/cc |
Sieve Analysis |
+200 Mesh: 0% -200/+325 Mesh: 4.8% -325 Mesh: 95.2% |
HTS Code | 7406.10.0000 |
NMFC | 30743 |
CAS No. | 7440-50-8 |
Product Code | CU112SP |
Applications and Benefits:
- Thick and thin film pastes
- Capacitor chips
- End cap terminators
- Conductive inks, paints, and pastes
- Injection molding
- Electronics
- Thermal management
- EDM electrodes
- Thermal sprays
- Sintered alloys/products
- Brazing/soldering paste
Caution:
Handle with care. Refer to the SDS for detailed safety guidelines.
Copper Powder 99.8%, Electronic Grade, Mesh 325
Electronic grade, high-purity copper powder made via water atomization and hydrogen reduction. Features ultra-fine, spheroidal particles with high conductivity and low density. Recommended for a variety of applications where conductivity is crucial, including thick and thin film pastes, capacitor chips, and thermal sprays. Note: Pure copper powders may not exhibit conductivity under low-voltage tests but will conduct when compacted or mixed with oils or resins.
Product Specifications
Purity | 99.85% |
Hydrogen Loss | 0.19% |
Apparent Density | 2.97 g/cc |
Mesh Size | 325 mesh |
Sieve Analysis | +60 Mesh: 0% -60/+80 Mesh: 0% -80/+100 Mesh: 0% -100/+140 Mesh: Trace -140/+200 Mesh: Trace -200/+325 Mesh: 0.6% -325 Mesh: 99.4% |
HTS Code | 7406.10.0000 |
NMFC | 30743 |
CAS No. | 7440-50-8 |
Applications and Benefits:
- Thick and thin film pastes
- Capacitor chips
- End cap terminators
- Conductive inks, paints, and pastes
- Injection molding
- Electronics
- Thermal management
- EDM electrodes
- Thermal sprays
- Sintered alloys/products
- Brazing/soldering paste
Caution:
Handle with care. Refer to the SDS for detailed safety guidelines.
Copper Powder > 99% (150 - 325 Mesh)
General-purpose, highly pure (>99%) copper powder made from electrolytic copper. Granular copper with a mesh size of 150 - 325. Known for its excellent electrical and thermal conductivities, this product finds use in the electrical and electronic industries. Additional applications include self-lubricating bearings, brazing, cold soldering, and mechanical plating. It is also used for antifouling paints, decorative and protective coatings, printing inks, medals, medallions, metal-plastic decorative products, and various chemical and medical purposes.
Product Specifications
Purity | >99% |
Mesh Size | 150 - 325 |
Screen Analysis |
+60: 0.0% -60/+100: 0.7% -100/+200: 89.7% -200/+325: 9.1% -325: 0.5% |
Applications and Benefits:
- Electrical and electronic applications
- Self-lubricating bearings
- Brazing and cold soldering
- Mechanical plating
- Antifouling paints and decorative coatings
- Printing inks
- Medals, medallions, and metal-plastic decorative products
- Chemical and medical purposes
Caution:
Handle with care. Refer to the SDS for detailed safety guidelines.
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