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CU264: Copper Powder, 99.5%, Mesh 100
High purity copper powder, nominal mesh 100, Apparent density: 2.6 g/cc, Copper > 99.5%, with irregular shape particles. Used in powder metallurgy. May be admixed with other metal powders and graphite for specific properties such as strength, hardness and wear resistance for structural parts.
HTS Code: 7406.10.0000
NMFC: 30743
CAS: 7440-50-8
Note: Pure copper powders do not show continuity or conductivity when tested with a multimeter. This might be due to two reasons. One reason is the low voltage used for the test. The other reason is the presence of air and weak contacts between the particles. They will exhibit conductivity with higher voltage, when compacted, and when mixed with some oil or resin to form a paste.
Safety Data Sheet for Copper Powder
Key Features
- High Purity Copper (>99.5%)
- Nominal Mesh 100 for fine granularity
- Irregular particle shape for diverse uses
- Compatible with other metals and graphite
- Conductivity with higher voltage or when compacted
Product Specifications
Apparent Density | 2.6 g/cc |
Purity | > 99.5% Copper |
Particle Shape | Irregular |
Conductivity | At higher voltages/when compacted |
Applications | Powder Metallurgy, Alloys |
Similar Products
- High purity bronze powder, metallurgy
- Fine granular aluminum powder, industrial
- Nickel powder, high density, 99% purity
- Spherical zinc powder, corrosion-resistant
- Iron powder, magnetic, for alloys
Note: These are similar products, and each product is different, so research is required to find the best fit for your needs.
Perfect for Metallurgists, Industrial Manufacturers, Material Scientists, Engineering Students, Research and Development Labs
Copper Powder 99+%, Mesh 200
High-purity copper powder made via water atomization and hydrogen reduction. Features very fine, irregular particles and clusters with relatively lower density. Recommended for applications requiring high purity and conductivity, including diamond wheels, sintering, and chemical reactions. Note: Pure copper powders may not exhibit conductivity under low-voltage tests but will conduct when compacted or mixed with oils or resins.
Product Specifications
Purity | 99.3% |
Hydrogen Loss | 0.39% |
Apparent Density | 2.6 - 2.8 g/cc |
Mesh Size | 200 mesh |
Sieve Analysis |
+100 Mesh: Trace +140 Mesh: 1% Max +200 Mesh: 3% Max +325 Mesh: Balance -325 Mesh: 90% Min |
HTS Code | 7406.10.0000 |
NMFC | 30743 |
CAS No. | 7440-50-8 |
Applications and Benefits:
- Thick and thin film pastes
- Conductive inks, paints, and pastes
- Injection molding
- Thermal management
- EDM electrodes
- Antifouling paints
- Thermal sprays
- Sintered alloys/products
- Brazing/soldering paste
- Diamond wheels
- Chemical reactions
Caution:
Handle with care. Refer to the SDS for detailed safety guidelines.
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