Copper Powder > 99.5% - Spherical, 100 Mesh

Spherical Copper Powder - 100 Mesh - 99.5%+ Cu

 High-purity spherical copper powder consisting predominantly of spherical copper particles with a bright reddish-copper appearance. The 100 mesh grade is coarse relative to fine and ultra-fine copper powders. Because the particles are rounded and smooth, the powder flows freely, packs to a high tap density, and behaves consistently during die filling and dosing.

Calibrated microscopy of the current material shows that the mass is carried primarily by coarse spheres near the top of the 100 mesh cut, together with a population of smaller particles that contributes relatively little to the overall mass. This produces the characteristic appearance of larger spheres surrounded by finer particles. Practically all of the material passes through mesh 100 sieve, corresponding to an opening of approximately 150 microns, and the typical mass-median particle size is approximately 120 microns.

The coarse spherical morphology provides a lower specific surface area than fine or ultra-fine copper powder, contributing to improved storage stability and slower development of surface oxidation. Copper powder may exhibit limited electrical continuity when tested as loose powder because individual particles are not necessarily in continuous contact. Conductivity can increase substantially after compaction or when the powder is incorporated into a suitable resin, oil, polymer, or other matrix.

Product Specifications

Typical Particle Size Distribution

The values below are typical mass-based results obtained from calibrated optical image analysis of the current material. Percentages are cumulative and represent the share of total mass finer than each listed sieve opening. These values are provided as general guidance for particle-size selection and may vary from lot to lot.

Typical percentile sizes by mass are approximately Dv10 near 85 microns, Dv50 near 120 microns, and Dv90 near 135 microns. Most of the mass falls between approximately 105 and 150 microns, resulting in a coarse, relatively narrow particle-size distribution immediately below the 100 mesh opening. A finer particle population is present by particle count but contributes relatively little to total mass. These figures are derived from image analysis and are not a certified sieve analysis.

Particle Characteristics

• Predominantly spherical and near-spherical copper particles with smooth metallic surfaces.
• Free-flowing morphology supports even die filling and consistent dosing.
• Good packing characteristics and high tap density associated with spherical morphology.
• High metallic copper content of 99.5% minimum supports electrical and thermal conductivity after compaction or incorporation into a suitable matrix.
• Lower specific surface area than fine or ultrafine copper provides improved storage stability and slower surface oxidation.
• Coarse spherical particles carry most of the material mass, with a finer population present primarily by particle count.
• Material mass is concentrated near the upper end of the 100 mesh cut, with essentially all material passing 100 mesh.
• Bright reddish-copper metallic appearance.
• Suitable for formulations requiring metallic copper with a relatively coarse, controlled particle size.

Applications and Benefits:

• Powder metallurgy and press-and-sinter components.
• Sintered porous parts, including filters and self-lubricating bearings, where spherical morphology can provide controlled, interconnected porosity.
• Metal-filled polymers, resins, and epoxies.
• Thermally conductive compounds and gap fillers.
• Bulk metallic filler in compounded conductive pastes, adhesives, and sealants. This is a coarse-particle filler rather than a fine-line printing ink powder.
• Cold casting and metal-filled resin castings that can be sanded and polished to produce a metallic copper surface.
• Decorative metallic epoxy, resin, and coating finishes requiring a visible copper effect.
• Metal-bonded matrix and friction formulations using copper as a matrix metal.
• Copper-based brazing and joining formulations.
• Copper metal reagent for laboratory and research chemistry.
• Educational demonstrations involving metallic powders.
• High-density and specialty industrial filler applications.

Caution:

Fine metal powders should be handled carefully to minimize airborne dust. Avoid inhalation, unnecessary dust generation, and contact with incompatible materials or ignition sources. Refer to the current SDS for complete handling, storage, personal protection, and disposal information.