Copper Powder CU112SP

CU112SP is a super fine, high density, high purity spherical copper powder that provides high heat conductivity and electrical conductivity properties to your products.
Our specification guarantees that at least 95% of this powder are particles smaller than 44 micron. A typical analysis however shows that 99.9% of particles are smaller than 44 micron. Most particles are between 10 micron and 22 micron.
HTS Code: 7406.10.0000
NMFC: 30743
CAS: 7440-50-8

Applications include cold casting, 3-D printer filaments, metal clay, sintering, Green/ blue patina and rust effect, preventing mold in concrete, plaster,dry-wall, paint, adhesives and grout.
Also used in 3D printing process known as Selective Powder Deposition (SPD)
Old product code: CU155A

Note: Pure copper powders do not show continuity or conductivity when tested with a multimeter. This might be due to two reasons. One reason is the low voltage used for the test. The other reason is the presence of air and weak contacts between the particles. They will exhibit conductivity with higher voltage, when compacted, and when mixed with some oil or resin to form a paste.

Safety Data Sheet for Copper Powder

Key Features

• Super fine, spherical particles
• High density and purity
• Excellent thermal and electrical conductivity
• Consistent particle size distribution
• Versatile applications in industry and art

Product Specifications

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