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CU264Copper Powder, 99.5%, Mesh 100$33 - $1650CU301ECopper Powder 99.8%, Electronic Grade, Mesh 325$35 - $19100CU301Copper Powder 99.3%, Mesh 325$35 - $10250CUPDRCopper Powder > 99% (150 - 325 Mesh)$3.99 - $120CU35HPCopper Granules, 35 Mesh (Coarse Copper Powder)$45 - $2200
Copper Powder 99.5% - 99.9%
Ultra-fine, very high purity copper powder made via air atomization and hydrogen reduction. Features spherical particles with high conductivity and density. Recommended for diverse applications, including thick and thin film pastes, capacitor chips, end cap terminators, and thermal sprays. Note: Pure copper powders may not exhibit conductivity under low-voltage tests but will show conductivity when compacted or mixed with oils or resins.
Product Specifications
Purity 99.81% Iron 0.01% Hydrogen Loss 0.18% Apparent Density 4.89 g/cc Sieve Analysis +200 Mesh: 0%
-200/+325 Mesh: 4.8%
-325 Mesh: 95.2%HTS Code 7406.10.0000 NMFC 30743 CAS No. 7440-50-8 Product Code CU112SP
Applications and Benefits:
- Thick and thin film pastes
- Capacitor chips
- End cap terminators
- Conductive inks, paints, and pastes
- Injection molding
- Electronics
- Thermal management
- EDM electrodes
- Thermal sprays
- Sintered alloys/products
- Brazing/soldering paste
Caution:
Handle with care. Refer to the SDS for detailed safety guidelines.
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