Copper Powder 99.5% - 99.9%
Ultra-fine, very high purity copper powder made via air atomization and hydrogen reduction. It features spherical particles with high conductivity and density. Recommended for diverse applications including thick and thin film pastes, capacitor chips, end cap terminators, conductive inks, paints and pastes, injection molding, electronics, thermal management, EDM electrodes, thermal sprays, sintered alloys and products, and brazing or soldering paste. Pure copper powders may not exhibit conductivity under low-voltage tests but will show conductivity when compacted or mixed with oils or resins.
Product Specifications
| Purity | 99.81% |
| Iron | 0.01% |
| Hydrogen Loss | 0.18% |
| Apparent Density | 4.89 g/cc |
| Sieve Analysis |
+200 Mesh: 0% -200/+325 Mesh: 4.8% -325 Mesh: 95.2% |
| HTS Code | 7406.10.0000 |
| NMFC | 30743 |
| CAS No. | 7440-50-8 |
Applications and Benefits:
- Thick and thin film pastes
- Capacitor chips
- End cap terminators
- Conductive inks, paints, and pastes
- Injection molding
- Electronics
- Thermal management
- EDM electrodes
- Thermal sprays
- Sintered alloys and products
- Brazing and soldering paste
- Spherical particle morphology
- High conductivity and density
- Very high purity copper content
Caution:
Handle with care. Refer to the SDS for detailed safety guidelines, Product color may vary from LOT to LOT.
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SDS_Copper_Powder.pdf